Microstructure and Residual Stress of Metallic Thin Films According to Deposition Parameters
[Park, Byung-Jun;Kim, Young-Man;]
Department of Materials Science and Engineering Chonnam National University;
한국표면공학회지, Vol. 36, No. 1, pp. 1-8.
DOI :
Polymerized Organic Thin Films and Comparison on their Physical and Electrochemical Properties
[Cho, S.H.;You, Y.J.;Kim, J.G.;Boo, J.H.;]
Center for Advanced Plasma Surface Technology, SungKyunKwan University;
한국표면공학회지, Vol. 36, No. 1, pp. 9-13.
DOI :
[Shin, Y.S.;Jeong, S.H.;Heo, C.H.;Bae, I.S.;Kwak, H.T.;Lee, S.B.;Boo, J.H.;]
Department of Chemistry and Center for Advanced Plasma Surface Technology, SungKyunKwan University;Department of Chemistry, Kookmin University;
한국표면공학회지, Vol. 36, No. 1, pp. 14-21.
DOI :
[Musil, J.;Stadnik, T.;Cernansky, M.;]
Department of Physics, University of West Bohemia, Institute of Physics, Academy of Sciences of the Czech Republic;Department of Physics, University of West Bohemia;
한국표면공학회지, Vol. 36, No. 1, pp. 22-26.
DOI :
Pulsed Magnetron Sputtering Deposit ion of DLC Films Part I : Low-Voltage Bias-Assisted Deposition
[Oskomov, Konstantin V.;Chun, Hui-Gon;You, Yong-Zoo;Lee, Jing-Hyuk;Kim, Kwang-Bok;Cho, Tong-Yul;Sochogov, Nikolay S.;Zakharov, Alexender N.;]
Inst. of High Current Electronics, Siberian Div. of RAS;School of Materials Science and Engineering, ReMM, University of Ulsan;
한국표면공학회지, Vol. 36, No. 1, pp. 27-33.
DOI :
Effect of Additives and Plating Conditions on Sn-Pb Alloy Film of Semiconductor Formed by High Speed Electroplating
전해도금에 의해 형성된 반도체 금속도금용 주석-납 합금피막의 첨가제 및 전해조건의 영향
정강효;김병관;박상언;김만;장도연;
창원대학교 화공시스템공학과;한국기계연구원 표면연구부;
한국표면공학회지, Vol. 36, No. 1, pp. 34-41.
DOI :
Effect of Bismuth Addition on the Zinc Consumption in Hot-Dip Galvanizing
용융아연도금에서 비스머스 첨가에 의한 아연 수율향상에 관한 연구
[Kim, S.K.;Yoo, J.S.;]
울산대학교 첨단소재공학부;LG CNS;
School of Materials Science and Engineering, University of Ulsan;LG CNS, Ltd.;
한국표면공학회지, Vol. 36, No. 1, pp. 42-47.
DOI :
Plasma Aided Process As Alternative to Hard Chromium Electroplating
[Kwon, Sik-Chol;Lee, K.H.;Kim, J.K.;Kim, M.;Lee, G.H.;Nam, K.S.;Kim, D.;Chang, D.Y.;]
Surface Engineering Department, IOM/KIMM;
한국표면공학회지, Vol. 36, No. 1, pp. 48-58.
DOI :
A Study on Low Temperature Phosphating for Cold Forming
냉간 가공용 인산염 피막처리의 저온화에 관한 연구
이만식;정충택;이광호;김준호;이근대;홍성수;
부경대학교 화학공학부;삼양화학산업(주) 기술연구소;
한국표면공학회지, Vol. 36, No. 1, pp. 59-68.
DOI :
Flow Characteristics of An Atmospheric Pressure Plasma Torch
[Moon, Jang-H.;Kim, Youn-J.;Han, Jeon-G.;]
Center for Advanced Plasma Surface Technology, SungKyunKwan University;
한국표면공학회지, Vol. 36, No. 1, pp. 69-73.
DOI :
Corrosion Protection of Plasma-Polymerized Cyclohexane Films Deposited on Copper
[Park, Z.T.;Lee, J.H.;Choi, Y.S.;Ahn, S.H.;Kim, J.G.;Cho, S.H.;Boo, J.H.;]
Center for Advanced Plasma Surface Technology, Sung Kyun Kwan University;
한국표면공학회지, Vol. 36, No. 1, pp. 74-78.
DOI :
[Ahn, S.H.;Yoo, J.H.;Kim, J.G.;Lee, H.Y.;Han, J.G.;]
Center for Advanced Plasma Surface Technology (CAPST) SungKyunKwan University;
한국표면공학회지, Vol. 36, No. 1, pp. 79-84.
DOI :
The Oxidation of Polymethylsiloxane/MoSi
[Moon, Jae-Jin;Lee, Dong-Bok;Kim, Deug-Joong;]
School of Metallurgical and Materials Engineering, Sungkyunkwan University;
한국표면공학회지, Vol. 36, No. 1, pp. 85-88.
DOI :
Corrosion Characteristics of Ti, Ti/Cr Coated and Plasma-Nitrided Surface for Stainless Steel Containing Ti
Ti가 함유된 스테인리스강에서 Ti, Ti/Cr 코팅표면과 플라즈마질화표면의 부식특성
최한철;이승훈;김관휴;
광양보건대학 치기공과;전남대학교 금속공학과;
한국표면공학회지, Vol. 36, No. 1, pp. 89-98.
DOI :
The Measurement of Diffusion Coefficient of Fission Gases in Urania with Respect to O/M Ratio
화학당량에 따른 우라니아의 핵분열 기체 확산 계수 측정
김희문;박광헌;김봉구;주용선;김건식;송근우;홍권표;강영환;
경희대학교 원자력공학과;한국원자력연구소;
한국표면공학회지, Vol. 36, No. 1, pp. 99-107.
DOI :