저널

A Study on the Electrical Properties of Pt Thin film RTD for Temperature Sensor
온도센서용 Pt박막 측온저항체의 전기적 특성에 관한 연구

문중선;정광진;최성호;조동율;천희곤;

울산대학교 재료, 금속 공학부;

한국표면공학회지, Vol. 32, No. 1, pp. 3-9.

DOI :

Shape and Chemical Composition Change of Laser Spot Alloyed Layer with Process Parameters
공정변수에 따른 Laser spot 합금층의 형상 및 성분변화 예측

최정영;이창희;

No address;

한국표면공학회지, Vol. 32, No. 1, pp. 10-20.

DOI :

A Study on Coating Adhesion of Hot Rolled Galvanized Iron Manufactured without pickling process
산세생략형 열연 용융아연도금강판의 특성

최진원;전선호;

포항종합제철주식회사 기술연구소 광양압연연구그룹;

한국표면공학회지, Vol. 32, No. 1, pp. 21-30.

DOI :

Effect of Al content on coating adhesion of hot rolled galvanized iron manufactured without pickling process
무산세 열연 용융아연도금강판의 도금밀착성에 미치는 도금욕 Al농도의 영향

전선호;최진원;

포항종합제철주식회사 기술연구소 광양압연연구그룹;

한국표면공학회지, Vol. 32, No. 1, pp. 31-42.

DOI :

A Surface Study of 304 and 316 Stainless Steel Oxidized between $300^{circ}C$ and $500^{circ}C$
$300^{circ}C$와 $500^{circ}C$사이에서 산회된 304, 316 스테인리스강의 표면특성

김경록;이경구;강창석;최답천;이도재;

전남대학교 공과대학 금속공학과;한려대학교 제철금속학과;

한국표면공학회지, Vol. 32, No. 1, pp. 43-48.

DOI :

A Study on the Cyclic Oxidation Properties of Aluminum Diffusion Coated Materials
알루미늄 확산코팅재료의 주기산화 특성에 관한 연구

강석철;민경만;김길무;

한국원자력안전기술원;충남대학교 재료공학과, 급속응고신소재연구소;

한국표면공학회지, Vol. 32, No. 1, pp. 49-60.

DOI :

Tunneling magnetoresistance in ferromagnetic tunnel junctions with conditions of insulating barrier preparation
부도체층 제작조건에 따른 강자성 터널접합의 투과자기저항 특성 연구

백주열;현준원;

단국대학교 물리학과;단국대학교 응용물리학과;

한국표면공학회지, Vol. 32, No. 1, pp. 61-66.

DOI :

Effect of the Heat treatment and Boron on the Hot Corrosion Resistance of the Al Diffusion Coating
Al 확산피복층의 고온 내식성에 미치는 후열처리와 B첨가의 영향

김태원;윤재홍;이재현;김현수;변응선;

창원대학교 공과대학 금속재료공학과;동북공업기술연구소 환경재료 연구실;한국기계연구원;

한국표면공학회지, Vol. 32, No. 1, pp. 67-77.

DOI :

A study of the GaN etch properties using inductively coupled Cl$_2$-based plasmas
유도 결합형 Cl$_2$계 플라즈마를 이용한 GaN 식각 특성에 관한 연구

김현수;이재원;김태일;염근영;

성균관대학교 재료공학과;삼성종합기술원 광반도체연구실;

한국표면공학회지, Vol. 32, No. 2, pp. 83-92.

DOI :

Investigation of the residue formed on the silicon exposed to $C_4$F$_8$ helicon wave plasmas
고선택비 산화막 식각공정시 $C_4$F$_8$ 헬리콘 웨이브 플라즈마에 노출된 실리콘 표면의 잔류막 관찰

김현수;이원정;염근영;

성균관대학교 재료공학과 반도체 공정 연구실;

한국표면공학회지, Vol. 32, No. 2, pp. 93-99.

DOI :

Microstructure and Corrosion Characteristics of Al-Si Diffusion Coated Ni Base Super alloy
Al-Si확산코팅에 따른 Ni기 초합금의 미세조직과 부식특성

안종천;김택수;윤동주;이경구;

국방과학연구소;충남대학교 금속공학과;한려대학교 제철금속학과;

한국표면공학회지, Vol. 32, No. 2, pp. 100-108.

DOI :

Field Application of an Alternative Cleaning Agent to Methylene Chloride
Methylene Chloride의 대체세정제 적용 사례 연구

배재흠;신민철;이통영;조기수;

수원대학교 화학공학과;삼성전기;삼성지구환경연구소;

한국표면공학회지, Vol. 32, No. 2, pp. 109-124.

DOI :

Electrical and Optical Properties of SnO$_2$: F Thin Films by Reactive DC Magnetron Sputtering Method
반응성 DC 마그네트론 스퍼터법에 의한 SnO$_2$ : F 박막의 전기광학적 특성

정영호;김영진;신재혁;송국현;신성호;박정일;박광자;

경기대학교 재료공학과;국립기술품질원;

한국표면공학회지, Vol. 32, No. 2, pp. 125-133.

DOI :

Effect of silicon on alloying behavior of hot-dip galvannealed steel sheets
합금화 용융아연 도금강판의 합금화 거동에 미치는 실리콘의 영향

이호종;김종상;

순천대학교 공과대학 재료·금속공학과;포항제철(주) 기술연구소;

한국표면공학회지, Vol. 32, No. 2, pp. 134-143.

DOI :

A Study on the high Temperature Properties of the Graded Thermal Barrier Coatings by APS and PAS
APS법으로 제조된 열장벽 피막과 PAS법으로 제조된 열장벽 성형체의 고온 물성에 관한 연구

강현욱;권현옥;한주철;송요승;홍상희;허성강;김선화;

한국항공대학교 항공재료공학과;서울대학교;창원대학교;순천향대학교;

한국표면공학회지, Vol. 32, No. 2, pp. 144-156.

DOI :

Effect of Nickel Addition in Hot Dip Galvanizing of Mini-mill Steels Containing Silicon
실리콘을 함유한 미니밀 소재의 용융아연도금성에 미치는 니켈첨가의 영향

[H. J., Lee;J. S., Kim;J. H., Chung;]

Dept. of Materials Science and Metallurgical Eng., Sunchon National University;Technical Research Laboratories, POSCO;

한국표면공학회지, Vol. 32, No. 2, pp. 157-164.

DOI :

Surface Reaction of Uranium Dioxide with CF$_4$/O$_2$ Mixture Gas Plasma
CF$_4$/O$_2$ 혼합기체 플라즈마를 이용한 이산화 우라늄의 표면식각반응

민진영;김용수;

한양대학교 원자력공학과;

한국표면공학회지, Vol. 32, No. 2, pp. 165-171.

DOI :

A Study on Electroless Ni-B Plating with DMAB as Reducing Agent. I. The Electrochemical Behavior of Precipitation Reaction on Austenite Stainless Steel Substrates
DMAB를 사용한 무전해 Ni-B 합금 도금 I. 오스테나이트 스텐레스강 상의 석출반응에 대한 전기화학적 거동

이창래;박해덕;강성군;

한양대학교 공과대학 재료공학과;(유) 해송피앤씨;

한국표면공학회지, Vol. 32, No. 2, pp. 172-181.

DOI :

Electrodeposited Multilayer Coating Systems

[Gabe, David R.;]

International Union for Surface Finishing and Iptme, Loughborough Univ.;

한국표면공학회지, Vol. 32, No. 3, pp. 195-207.

DOI :

STUDY FOR DEVELOPMENT OF AN ADDITIVE FOR SEMI-BRIGHTNESS FINISH FOR NICKEL ELECTOPLATING

[Han, M.K.;Lee, J.K.;]

Korea Institute of Industrial Technology (KITECH);

한국표면공학회지, Vol. 32, No. 3, pp. 208-210.

DOI :

Pb-FREE SOLDER PLATING

[Yada, Y.;Tokio, K.;]

2nd Development Department, Research Center, Ebara-Udylite Co., Ltd.;

한국표면공학회지, Vol. 32, No. 3, pp. 211-213.

DOI :

THE EFFECTS OF ADDITIVES IN NICKEL AND COPPER ELECTROPLATING FOR MICROSTRUCTURE FABRICATION

[Kim, Go-Eun;Lee, Jae-Ho;]

Dept. of Metallurgical Engineering and Materials Science Hongik University;

한국표면공학회지, Vol. 32, No. 3, pp. 214-218.

DOI :

Ferrous Chloride Pickling Bath A new process for pre-treatment of metals

[Ericson, U.H.;Ericson, H.A.H.;]

Korrosionsforskning AB, Sweden;Corrint Svenska KB, Sweden;

한국표면공학회지, Vol. 32, No. 3, pp. 219-223.

DOI :

CHARACTERISTICS OF PLATED GOLD LAYER ON ANSI 304 STAINLESS STEEL ACCORDING TO THE VARIATION OF PRETREATMENTS AND ELECTROLYSIS CONDITIONS

[Lee, Dong-hun;Lee, Jae-Bong;]

School of Metallurgical and Materials Engineering Kookmin University;

한국표면공학회지, Vol. 32, No. 3, pp. 224-234.

DOI :

ANALYSIS OF THE ANODIC OXIDATION OF SINGLE CRYSTALLINE SILICON IN ETHYLEN GLYCOL SOLUTION

[Yuga, Masamitsu;Takeuchi, Manabu;]

Graduate School of Science and Engineering, Ibaraki University;Department of Electrical and Electronic Engineering, Ibaraki University;

한국표면공학회지, Vol. 32, No. 3, pp. 235-238.

DOI :

CHARACTERIZATION OF METALLIC CONTAMINATION OF SILICON WAFER SURFACES FOR 1G DRAM USING SYNCHROTRON ACCELERATOR

[Kim, Heung-Rak;Kun-Kul, Ryoo;]

Research Institute of Industrial Science and Technology;Soonchunhyang University;

한국표면공학회지, Vol. 32, No. 3, pp. 239-243.

DOI :

PHOTOELECTRODEPOSITION OF COPPER ON BORON-DOPED DIAMOND FILMS: ITS APPLICATION TO CONDUCTIVE PATTERN FORMING ON DIAMOND AND DIAMOND PHOTOGRAPHIC PHENOMENON

[Yoshihara, S.;Shinozaki, K.;Shirakashi, T.;]

Department of Energy and Environmental Science, Graduate School of Engineering, Utsunomiya University;

한국표면공학회지, Vol. 32, No. 3, pp. 244-248.

DOI :

BORIDING OF STEEL WITH PECVD METHOD

[Lee, M.J.;Lee, K.Y.;Lee, J.H.;Kim, Y.H.;]

Dept. of Metallurgical Engineering and Materials Science Hongik University;

한국표면공학회지, Vol. 32, No. 3, pp. 249-252.

DOI :

INDUSTRIAL STATUS OF DRY PLATING AS AN ALTERNATIVE TO WET PLATING PROCESS IN KOREAN SURFACE FINISHING INDUSTRY

[Kwon, Sik-Chol;Baek, Woon-Sung;Lee, Gun-Hwan;Rha, Jong-Joo;]

KIMM;

한국표면공학회지, Vol. 32, No. 3, pp. 253-256.

DOI :

THE EFFECT OF AN APPLIED BIAS UPON THE REFLECTANCE AND ADHESION OF SILVER FILMS BEING SPUTTER-DEPOSITED ON POLYESTER SUBSTRATE

[Ri, Eui-Jae;Hoang, Tae-Su;]

KITech (SaengGiUeon);

한국표면공학회지, Vol. 32, No. 3, pp. 257-264.

DOI :

NEW PROGRESS IN TiN-BASED PROTECTIVE COATINGS DEPOSITED BY ARC ION PLATING

[Huang, R.F.;Wen, L.S.;]

SES and City University of Hong Kong Hong Kong;Institute of Metal Research, Academia Sinica;

한국표면공학회지, Vol. 32, No. 3, pp. 265-275.

DOI :

ELECTRICAL PROPERTIES OF ELECTROCHROMIC INDIUM NITRIDE THIN FILMS PREPARED BY RF ION PLATING

[Asai, N.;Inoue, Y.;Sugimura, H.;Takai, O.;]

Department of Materials Processing Engineering, Graduate School of Engineering, Nagoya University;

한국표면공학회지, Vol. 32, No. 3, pp. 276-280.

DOI :

MICROSTRUCTURE AND ELECTROCHEMICAL CHARACTERISTICS OF ELECTRODEPOSITED Zn-Ni ALLOY COATINGS

[Short, N.R.;Hui, Wen-Hua;Dennis, J.K.;]

School of Engineering and Applied Science, Aston University;Department of Materials Science & Engineering, Stevens Institute of Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 281-288.

DOI :

THE RECENT TREND OF BUILD-UP PRINTED CIRCUIT BOARD TECHNOLOGIES

[Takagi, Kiyoshi;]

TAKAGI Associates;

한국표면공학회지, Vol. 32, No. 3, pp. 289-296.

DOI :

INFRARED ABSORPTION MEASUREMENT DURING LOW-TEMPERATURE PECVD OF SILICON-OXIDE FILMS

[Inoue, Yasushi;Sugimura, Hiroyuki;Takai, Osamu;]

Department of Materials Processing Engineering, Nagoya University;

한국표면공학회지, Vol. 32, No. 3, pp. 297-302.

DOI :

EFFECT OF SUBSTRATE BIAS ON THE DIAMOND GROWTH USING MICROWAVE PLASMA CVD

[Sakamoto, Yukihiro;Takaya, Matsufumi;]

Chiba Institute of Technology, Precision Engineering;

한국표면공학회지, Vol. 32, No. 3, pp. 303-306.

DOI :

PREPARATION OF HYDROXYAPATITE COATINGS USING R.F. MAGNETRON SPUTTERING

[Hosoya, Satoru;Sakamoto, Yukihiro;Hashimoto, Kazuaki;Takaya, Matsufumi;Toda, Yoshitomo;]

Graduate school, Chiba Institute of Technology;Department of Precision Engineering, Chiba Institute of Technology;Department of Industrial Chemistry, Chiba Institute of Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 307-311.

DOI :

REACTION STEPS OF A FORMATION OF THE BLACK LAYER BEIWEEN IRON NTIRIDE AND TiN COATING

[Baek, W.S.;Kwon, S.C.;Lee, J.Y.;Rha, J.J.;Lee, S.R.;Kim, K.H.;]

Korea Institute of Machinery and Materials (KIMM);Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology (KAIST);Department of Metallurgy and Material, Yeungnam Univ.;

한국표면공학회지, Vol. 32, No. 3, pp. 312-316.

DOI :

TEXTURE AND RELATED PHENOMENA OF ELECTRODEPOSITS

[Lee, D.N.;]

Division of Materials Science and Engineering, and Research Center for Thin Film Fabrication and Crystal Growing of Advanced Materials, Seoul National University;

한국표면공학회지, Vol. 32, No. 3, pp. 317-330.

DOI :

ELECTROLESS PLATING OF NICKEL FOR MICRO-STRUCTURE FABRICATION

[Jin, Huh;Lee, Jae-Ho;]

Dept. of Metallurgical Engineering and Materials Science, Hongik University;

한국표면공학회지, Vol. 32, No. 3, pp. 331-335.

DOI :

PHOTOCATALYTIC REACTION OF $TiO_2$ FOR PURIFICATION OF AIR

[Yin, X.J.;Cai, R.X.;]

Chemical Process & Biotechnology Department, Singapore Polytechinc;Chemical Technology Centre, Singapore Productivity and Standards Board;

한국표면공학회지, Vol. 32, No. 3, pp. 336-339.

DOI :

ELECTRICAL BREAKDOWN INITIATION OF ANODIC FILMS DURING ANODIZING IN MOLTEN BISULPHATE MELT

[Han, S.H.;Thompson, G.E.;]

Cleaner Production Centre, Korea Institute of Industrial Technology;Corrosion and Protection Centre, University of Manchester Institute of Science and Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 341-343.

DOI :

EFFECT OF ARGON AND OXYGEN PLASMAS ON VARIOUS POLYETHYLENE SHEETS

[Chen, Yashao;Hirayama, Naoki;Gomi, Masaki;Kiuchi, Kenji;Momose, Yoshihiro;]

Department of Materials Science, Ibaraki University;

한국표면공학회지, Vol. 32, No. 3, pp. 344-350.

DOI :

MODIFICATION OF INITIALLY GROWN BN LAYERS BY POST-N$^{+}$ IMPLANTATION

[Byon, E.S.;Lee, S.H.;Lee, S.R.;Lee, K.H.;J. Tian;Youn, J.H.;Sung, C.;]

Korea Institute of Machinery & Materials;Harbin Institute of Technology;Changwon National University;Center for Advanced Materials, University of Massachusetts;

한국표면공학회지, Vol. 32, No. 3, pp. 351-355.

DOI :

HYDROXYAPATITE GRANULE IMPLANTED Ti-ALLOY

[Nonami, Toru;Taoda, Hiroshi;Kamiya, Akira;Naganuma, Katsuyoshi;Sonoda, Tsutomu;Kameyama, Tetsuya;]

National Industrial Research Institute of Nagoya;

한국표면공학회지, Vol. 32, No. 3, pp. 356-359.

DOI :

INVESTIGATION OF "STEPPED" DISCHARGE CURVES IN SINTERED TYPE NICKEL-CADMIUM CELL

[Sasaki, Y.;Yamashita, T.;]

Faculty of Engineering, Kanto Gakuin University;

한국표면공학회지, Vol. 32, No. 3, pp. 360-362.

DOI :

DISCHARGE CHARACTERISTICS OF NICKELOXIDE ELECTRODE PREPARED FROM ELECTROCHEMICAL IMPREGNATION

[Takenoya, K.;Sasaki, Y.;Yamashita, T.;]

Faculty of Engineering, Kanto Gakuin University;

한국표면공학회지, Vol. 32, No. 3, pp. 363-365.

DOI :

ON THE SONO-VOLTAMMETRY CURVES OF POLYCRYSTALLINE PLATINUM ELECTRODE IN SULFURIC ACID SOLUTION

[Chiba, Atsushi;Kobayashi, Katsuyoshi;Yamashita, Tsugito;]

Department of Materials Chemistry, Yokohama National University;Department of Industrial Chemistry, Kantogakuin Uneversity;

한국표면공학회지, Vol. 32, No. 3, pp. 366-371.

DOI :

CRYSTAL ORIENTATION OF ELECTROLESS COPPER AND ELECTRODEPOSITED NICKEL FILMS ON THE MAGNETS

[Chiba, Atsushi;Kobayashi, Katsuyoshi;Miyazaki, Hiroki.;Yoshihara, Sachio;Wu, Wen-Chang;]

Department of Materials Chemistry, Yokohama National University;Department of Industrial Chemistry, Utsunomiya University;Department of Chemical Engineering, Nan-Tai, Institute of Technology.;

한국표면공학회지, Vol. 32, No. 3, pp. 372-376.

DOI :

EFFECTS OF AMINES ON COPPER ETCHING WITH H$_2$SO$_4$-$H_2O$$_2$ SYSTEMS

[Kobayashi, Katsuyoshi;Minami, Naoki;Chiba, Atsushi;]

Department of Materials Chemistry, Yokohama National University;Department of Research and Development, Ferric Inc.;

한국표면공학회지, Vol. 32, No. 3, pp. 377-384.

DOI :

Electron field emission from various CVD diamond films

[Usikubo, Koji;Sakamoto, Yukihiro;Takaya, Matsufumi;]

Graduate school, Chiba Institute of Technology;Chiba Institute of Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 385-388.

DOI :

VOID DEFECTS IN COBALT-DISILICIDE FOR LOGIC DEVICES

[Song, Ohsung;Ahn, Youngsook;]

Department of Materials Science and Engineering, The University of Seoul;

한국표면공학회지, Vol. 32, No. 3, pp. 389-392.

DOI :

THE SURFACE CHARACTERISTICS OF NITROGEN ION IMPLANTED IRON ALUMINIDES

[Choe, Han-Cheol;]

Dept. of Metallurgical Engineering & IAGC Research Institute, Kwang Yang College;

한국표면공학회지, Vol. 32, No. 3, pp. 393-400.

DOI :

THE EFFECT OF PROCESS CONDITIONS ON THE PHYSICAL PROPERTIES OF SILVER FILMS PREPARED BY USING SPUTTERING ON POLYESTER SUBSTRATE

[Hoang, Tae-Su;Ri, Eui-Jae;]

KITech (SaengGiUeon);

한국표면공학회지, Vol. 32, No. 3, pp. 401-405.

DOI :

THE REFLECTANCE AND ADHESION OF SILVER FILMS PREPARED BY USING E-BEAM EVAPORATION ON POLYESTER SUBSTRATE

[Ri, Eui-Jae;Hoang, Tae-Su;]

KITech (SaengGiUeon);

한국표면공학회지, Vol. 32, No. 3, pp. 406-409.

DOI :

ADHESION STUDIES OF MAGNETRON-SPUTTERED COPPER FILMS ON INCONEL SUBSTRATES

[Lee, G.H.;Kwon, S.C.;Lee, S.Y.;]

Surface Engineering Laboratory, KIMM;Assessment & Planning, STEPI;

한국표면공학회지, Vol. 32, No. 3, pp. 410-415.

DOI :

A Study of Dry Etch Mechanism of the GaN using Plasma Mass Spectrometry

[Kim, H.S.;Lee, W.J.;Jang, J.W.;Yeom, G.Y.;Lee, J.W.;Kim, T.I.;]

Dept. of Materials Engineering, Sungkyunkwan University;Photonics Lab., Samsung Advanced Institute of Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 416-422.

DOI :

Plating of Permalloy Using Flow Cell

[Jeon, S.H.;Ahn, J.H.;Kang, T.;]

School of Materials Science and Engineering, Seoul National University;

한국표면공학회지, Vol. 32, No. 3, pp. 423-427.

DOI :

EFFECT OF ION BEAM ASSISTED CLEANING ON ADHESION OF ALUMINIUM TO POLYMER SUBSTRATE OF PC AND PMMA

[Kwon, Sik-Chol;Lee, Gun-Hwan;Lee, Chuel-Yong;Gob, Han-Bum;Lim, Jun-Seop;Goh, Sung-Jin;]

Surface Engineering Laboratory, KIMM;Aju Engineering Co.;

한국표면공학회지, Vol. 32, No. 3, pp. 428-432.

DOI :

PROPERTIES OF Mo COMPOUNDS AS A DIFFUSION BARRIER BETWEEN Cu AND Si PREPARED BY CO-SPUTTERING

[Lee, Yong-Hyuk;Park, Jun-Yong;Bae, Jeong-Woon;Yeom, Geun-Young;]

Department of Materials Engineering, SungKyunKwan University;

한국표면공학회지, Vol. 32, No. 3, pp. 433-439.

DOI :

CRYSTAL TRANSITION PROCESS DURING POST-BREAKDOWN IN THE MOLTEN SALT

[Han, S.H.;Thompson, G.E.;]

Cleaner Production Centre, Korea Institute of Industrial Technology;Corrosion and Protection Centre, University of Manchester Institute of Science and Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 440-443.

DOI :

A STUDY ON COPPER DEPOSITION PROCESS DURING ANODIC OXIDATION OF ALUMINIUM ALLOY

[Koh, I.S.;Han, S.H.;Shin, D.H.;]

Department of Metal & Material Science Engineering, Hanyang University;Cleaner Production Centre, Korea Instituteof Industrial Technology;

한국표면공학회지, Vol. 32, No. 3, pp. 444-446.

DOI :

ELECTROCHEMICAL STUDY OF ELECTROLESS PLATING OF SILVER

[Lee, Jae-Ho;]

Dept. of Metallurgical Engineering and Materials Science, Hong Ik University;

한국표면공학회지, Vol. 32, No. 3, pp. 447-451.

DOI :

CORROSION BEHAVIOR OF Al-Zn ALLOY AS A SACRIFICIAL ANODE OF ORV TUBES

[Jin, Huh;Lee, Ho-Kyun;Lee, Jae-Ho;]

Dept. of Metallurgical Engineering and Materials Science Hongik University;

한국표면공학회지, Vol. 32, No. 3, pp. 452-455.

DOI :

CONDUCTIVE SnO$_2$ THIN FILM FABRICATION BY SOL-GEL METHOD

[Lee, Seung-Chul;Lee, Jae-Ho;Kim, Young-Hwan;]

Dept. of Metallurgical Engineering and Materials Science, Hong Ik University;

한국표면공학회지, Vol. 32, No. 3, pp. 456-460.

DOI :

DIAMOND-LIKE CARBON FILMS FOR ANTIREFLECTION COATINGS OF GERMANIUM INFRATED OPTICAL LENSES

[Kim, Seong-Young;Lee, Sang-Hyun;Lee, Jai-Sung;]

Advanced Consumer Products R&D Center, KITECH;Depart. of Metallurgy and Materials Science, Hanyang University;

한국표면공학회지, Vol. 32, No. 3, pp. 461-466.

DOI :

DEPOSITION OF c-BN FILMS BY PULSED DC BIASING IN MAGNETICALLY ENHANCED ARE METHOD

[Lee, S.H.;Byon, E.S.;Lee, K.H.;J., Tian;Yoon, J.H.;Sung, C.;Lee, S.R.;]

Korea Institute of Machinery & Materials;Harbin Institute of Technology;Changwon National University;Center for Advanced Materials,University of Massachusetts,Lowell,MA 01854,U.S.A;

한국표면공학회지, Vol. 32, No. 3, pp. 467-471.

DOI :

Improvement of the Corrosion Resistance of PVD Hard Coating/Substrate Systems - Recent Developments -

[Jehn, Hermann A.;Kang, Sung-Goon;]

Forschungsinstitut fur Edelmetalle und Metallchemie;Hanyang University, Department of Materials Engineering;

한국표면공학회지, Vol. 32, No. 3, pp. 472-483.

DOI :

Electroless Ni Plating on Pb-base Ceramics
Pb계 Ceramics 기지상의 무전해 Ni 도금

민봉기;유종수;최순돈;신현준;

영남대학교 공과대학 금속 및 재료공학부;영남이공대학 금속·금형설계과;

한국표면공학회지, Vol. 32, No. 4, pp. 487-495.

DOI :

A study on the adhesion of Ag film deposited on Alloy42 substrate
Alloy42 기판 위에 증착된 Ag막의 밀착력에 관한 연구

이철룡;천희곤;조동율;이건환;권식철;

울산대학교 재료공학과;한국기계연구원;

한국표면공학회지, Vol. 32, No. 4, pp. 496-502.

DOI :

The TEM Characterization of the Interfacial Microstructure between In Solder and Au/Ni/Ti Thin Films during Reflow Process
리플로 공정 후에 형성된 In과 Au/Ni/Ti 다층 박막의 계면 구조의 TEM 분석

조원구;김영호;김창경;

한양대학교 공과대학 재료공학부;

한국표면공학회지, Vol. 32, No. 4, pp. 503-512.

DOI :

A study on the effects of variously configured magnets on the characteristics of inductively coupled plasma
자장의 배열 및 형태가 유도결합형 플라즈마에 미치는 효과에 관한 연구

황순원;이영준;유지범;이재찬;염근영;

성균관대학교 재료공학과;

한국표면공학회지, Vol. 32, No. 4, pp. 513-520.

DOI :

Corrosion resistance and Hardness of Tin-Nickel Electrodeposits
주석-니켈합금 도금층의 내식성 및 경도

예길촌;채영욱;

영남대학교 재료·금속공학부;

한국표면공학회지, Vol. 32, No. 4, pp. 521-530.

DOI :

Effect of Brown Oxide Formation on the Fracture Toughness of Leadframe/EMC Interface
Brown Oxide 형성이 리드프레임/EMC 계면의 파괴인성치에 미치는 영향

[H. Y., Lee;J., Yu;]

Dept. of Materials Science and Engineering Korea Advanced Institute of Science and Technology;

한국표면공학회지, Vol. 32, No. 4, pp. 531-537.

DOI :

Photoelectrochemical Property of Ti(IV)-Fe(III) Oxide Films Deposited by MOCVD
MOCVD법에 의한 Ti(IV)-Fe(III) 산화물 박막의 광전기화학적 특성

김현수;윤재홍;

동북공업기술연구소 환경재료연구실;창원대학교 공과대학 금속재료공학과;

한국표면공학회지, Vol. 32, No. 4, pp. 538-546.

DOI :

Interfacial Reaction of Galvanized Steel in Ni Added Zn-0.18Al Bath
Zn-0.18Al 도금욕에서 Ni첨가에 따른 아연 도금강의 계면반응

이경구;기회봉;이도재;

한려대학교 제철금속학과;아시아자동차 기술연구소(주);전남대학교 공과대학 금속공학과;

한국표면공학회지, Vol. 32, No. 4, pp. 547-554.

DOI :

Edge overcoating and buildup of continuously hot-dip metallized strip
연속 용융도금 강판의 에지 과도금 및 빌드업

박정렬;전선호;박노범;

포항제철(주) 기술연구소 광양압연연구그룹;

한국표면공학회지, Vol. 32, No. 4, pp. 555-560.

DOI :

Fracture Toughness of Leadframe/EMC Interface
리드프레임/EMC 계면의 파괴 인성치

이호영;유진;

한국과학기술원 재료공학과;

한국표면공학회지, Vol. 32, No. 6, pp. 647-657.

DOI :

Characterization of a Helicon Plasma Source
헬리콘 플라즈마원의 특성

현준원;노승정;김경례;김창연;김현후;

단국대학교 응용물리학과;두원공과대학 전자공학과;

한국표면공학회지, Vol. 32, No. 6, pp. 658-664.

DOI :

The study on Luminescent properties of Red Emitting phosphor for plasma display panel
PDP용 적색형광체의 발광특성에 관하여

[Choe, J.I.;]

한국표면공학회지, Vol. 32, No. 6, pp. 665-670.

DOI :

Control of ITO/PET Thin Films Depending on the Ratio of Oxygen Partial Pressure in Sputter
스퍼터의 산소분압비율에 의존한 ITO/PET박막의 조절

김현후;신재혁;신성호;박광자;

두원공대 전자과;기술표준원 무기화학과;

한국표면공학회지, Vol. 32, No. 6, pp. 671-676.

DOI :

Design of Amorphous Magnetic Materials for high frequency Sensors Based Upon Permalloy Characteristics
퍼멀로이 특성을 기초로 한 고주파 센서에 사용되는 비정질 자성재료의 개발

[Yoo, C.K.;Kim, C.K.;Chung, Y.C.;O`handley, R.C.;]

Division of Materials Engineering, Hanyang University;Division of Chemical Engineering, Hanyang University;Department of materials science and engineering, MIT;

한국표면공학회지, Vol. 32, No. 6, pp. 677-685.

DOI :

Preparation and Characterization of Insoluble Anodes for Electrodeposition of Ni-W Alloys in Ammoniacal Citrate Bath
Ni-W 합금도금용 불용성 양극의 제조 및 특성 연구

장도연;강성군;

한국기계연구원 표면기술연구부;한양대학교 재료공학부;

한국표면공학회지, Vol. 32, No. 6, pp. 686-694.

DOI :

A study on the factors affecting Cu(Mg) alloy resistivity
Cu(Mg) alloy의 비저항에 영향을 미치는 인자에 대한 연구

조흥렬;조범석;이재갑;박원욱;이은구;

국민대학교 금속재료공학부;한국기계연구원;조선대학교 금속재료공학부;

한국표면공학회지, Vol. 32, No. 6, pp. 695-702.

DOI :

A study of microstructure of Ni-monosilicide fabricated with a thermal evaporator
열증착법으로 제조된 니켈 모노실리사이드의 미세구조 연구

안영숙;송오성;양철웅;

서울시립대학교 재료공학과;성균관대학교 금속·재료공학부;

한국표면공학회지, Vol. 32, No. 6, pp. 703-708.

DOI :

Adhesion improvement between metal and ceramic substrate by using ISG process
ISG법에 의한 금속과 세라믹기판과의 밀착력 향상

김동규;이홍로;추현식;

충남대학교 공과대학 금속공학과;조선대학교 공과대학 금속공학과;

한국표면공학회지, Vol. 32, No. 6, pp. 709-716.

DOI :